Recently, Redmi’s head Lu Weibing in a post on Weibo confirmed the upcoming Redmi flagship would indeed feature the 3.5mm audio jack, which will come as a relief to audiophiles. However, he did not share any other details about the phone.
Today, for this new Smartphone that has not been released but everyone has been waiting for a long time, on the Chinese social network Weibo the general manager of Redmi has shared the detail about the chipset of this phone, He suggested that the new Redmi’s Smartphone will have Snapdragon 855 and a very narrow chin.
Earlier, Xiaomi’s product director Wang Teng Thomas shared an image on Weibo, which was promptly deleted. But once it is posted on the Internet, it is always present.
As you can see, Xiaomi’s founder, Lin Bin is in the background with two smartphones: One in his hand, and the other on the table. The red smartphone lying on the table shows us several features, which makes it confirmed that this is going to be the next flagship from Redmi which is likely to debut in May.
Read Also: iPhone X Fold: Here Is the New Folding Smartphone By Apple
Do not forget to follow us on our Facebook group and page to keep you always aware of the latest advances, News, Updates, review, and giveaway on smartphones, tablets, gadgets and more from the technology world of the future.