Qualcomm has previously previewed the Snapdragon Summit this November, with the release of the Snapdragon 8 Gen 2 flagship chip expected, and Mediatek’s Dimensity-9 iteration chip on the other side.
It was previously revealed that the iterative platform of Dimensity 9 Series is called “DX2” in the industry, and today Weibo blogger @Digital chat station revealed that the chip name is Dimensity 9200, which is expected to be released in November.
According to Weibo blogger @iBingcosmic, Dimensity 9200 chip is expected to adopt X3 big core CPU and ARM’s latest G715 GPU, which will be greatly improved. In terms of performance, at present, the engineering machine equipped with Dimensity DX2 chip outperforms Qualcomm Snapdragon 8 Gen 2.
Microblog @Digital chat recently revealed that from the perspective of supply chain channels, the new Dimensity 9200 includes two vivo X series, one OPPO Find X series, and one from an esports brand.
Read Also: Redmi K50S New Flagship Revealed with Dimensity 8 Series Iterative Chip
In November, Mediatek launched its first flagship 4nm chip, Dimensity 9000, Igeekphone has learned. In June this year, Mediatek officially launched a small upgrade of the chip, Dimensity 9000+. Dimensity 9200 chip is still expected to use TSMC’s 4nm process.