Igeekphone on October 16 news, @mobile chip master released a micro blog on October 14, revealing that the A20 chip used by Apple iPhone in 2026 uses a new WMCM package, and the memory is also upgraded to 12GB.
Here is a brief explanation of the related terms in Weibo:
APTS: Advanced packaging and testing
InFo: Integrated fan-out package is a semiconductor packaging technology developed by Taiwan Semiconductor Manufacturing Company (TSMC) in 2017. It belongs to a form of wafer-level packaging (WLP), which is mainly used to improve the integration and performance of semiconductor chips.
WMCM: The full name is Wafer-Level Chip-Scale Packaging, which is an advanced semiconductor packaging method. The chip can be packaged at the wafer level, which means that the packaging process is completed on the entire wafer, which can significantly reduce the size of the package and improve the integration.
WMCM packages excel in signal transmission, reducing signal latency and interference to improve overall performance, a feature that is particularly important for devices that require high-speed data processing.
Combined with the fact that TSMC will mass-produce the 2nm process by the end of 2025, Apple has booked the full capacity of the initial mass production of TSMC’s 2nm process.
So it is no surprise that the iPhone18 series will really use the 2nm process, and compared with the 3nm process, the 2nm process is expected to improve performance by 10-15% and reduce power consumption by up to 30%.
The source said in a follow-up tweet that the iPhone 17 and iPhone 18 both have 12GB DRAM, but it is not clear whether it is all series or only Pro models.