Today, RealMe is warming up the new RealMe GT Neo3. It is only 8.2mm thick and weighs only 188g, making it the lightest Mediatek Dimensity 8100 model to date.
Under the thin body, Realme GT Neo3 is equipped with diamond ice core heat dissipation system Max, with an internal area of 4129mm² 3D toughened VC and a total heat dissipation area of 39,606mm ², ensuring strong and stable output.
In addition, Realme GT Neo3 is equipped with Dimensity 8100 chip. The chip is mediatek’s second-flagship processor, positioned second only to Dimensity 9000.
It adopts TSMC 5nm process and consists of four Cortex A78 core cores with CPU frequency of 2.85ghz and four Cortex A55 small cores with CPU frequency of 2.0ghz. The GPU is G610 MC6, and The performance of Antutu exceeds 820,000 points, surpassing that of Snapdragon 888.
In terms of parameters, RealMe GT Neo3 adopts the mid-hole straight screen scheme, the refresh rate is 120Hz, the resolution is FHD+, the rear main camera is 50 million pixels IMX766, supporting OIS optical shock protection, the battery is 4500mAh, and it supports 150W light-speed second charge.
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Realme GT Neo3 will launch on March 22, and pre-orders are now available on major e-commerce platforms.