Today, on the occasion of the MediaTek Dimensity flagship strategy and new platform launch conference, Vivo Senior Vice President Shi Yujian announced through a video that Vivo will be the first to be equipped with Dimensity 9000 flagship platform.
The Dimensity 9000 flagship platform launched by MediaTek is the first to apply TSMC’s 4nm process technology, while adopting the Cortex-X2 architecture and supporting LPDDR5x 7500Mbps memory, making it one of the most competitive flagship mobile SoCs. At the same time, the AI BenchMark running score of Dimensity 9000 flagship platform has also been exposed recently. The result of 692 points directly surpasses the flagship chips in the Android camp currently on the market.
The image processing capability of the Dimensity 9000 flagship platform has improved significantly. Built-in flagship 18-bit HDR-ISP image signal processor , processing power is nearly 3 times ahead of the current flagship chip, up to 320 million pixel camera image signal capture capability, can achieve three maximum pixels of 32 million Sensors at the same time shooting HDR video has a stronger calculation speed than the previous generation ISP.
Vivo said that under the cooperation of Vivo and the new Dimensity9000 flagship platform, Vivo’s flagship products will also bring consumers better image and camera capabilities, a stronger performance experience, and a more intimate user experience.
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OPPO announced that the next-generation Find X flagship series will be equipped with Dimensity 9000 5G mobile platform for the first time, and Redmi also announced the first batch of K50 series to be equipped with Dimensity 9000.
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