Qualcomm’s next big push against Intel and AMD is coming. After many rumors about the Snapdragon 1000, new details begin to emerge regarding its possible specifications, which should make the “Always Connected PCs” more powerful and start a strong dispute against its competitors.
According to WinFuture, the Snapdragon 1000 will be presented with a much smaller size than the Intel U series processors: the site points to be packs of 20 x 15 mm, against the packs of 45 x 24 mm of the rival. Another important specification of the platform is regarding its great support for up to 16 GB of LPDDR4X RAM and two 128 GB modules of UFS 2.1 storage, resulting in a total of 256 GB. The devices will also have support for Gigabit WLAN.
Among other great news of the Snapdragon 1000 is the fact that the processor is not fully welded to the board. It will feature a dedicated socket just like those of Intel and AMD for computers. Qualcomm’s decision may increase the surface area of the chip, but until the final release, many decisions may change.
As we pointed out earlier, the processor should have 12W of TDP (against 6.5W of current models) and the first device with the Snapdragon 1000 could be the notebook code-named Primus, Asus. More information should emerge in the coming months.
We are not clear when Qualcomm plans to launch Snapdragon 1000, although it is said that it could arrive in 2019. At the architectural level, everything seems to point out that it will use customized Cortex-A76 cores to offer a significant improvement in terms of CPU performance and that it will have a new Adreno GPU.
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It is clear that performance has been one of the major problems faced by the Windows 10 platform on the ARM, but we must bear in mind that it has also taken its toll on the high price of equipment and a lower autonomy than promised. What has been said means, in short, that they not only have to improve performance but also autonomy and price?
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